Modulator with signal electrode enclosed by ground electrode
A modulator may include a substrate. The modulator may include one or more waveguides formed upon or formed in the substrate. A signal electrode may be provided adjacent to at least one of the one or more waveguides and may include a curved outer surface. The modulator may include one or more ground...
Saved in:
Main Authors | , |
---|---|
Format | Patent |
Language | English |
Published |
08.05.2018
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Summary: | A modulator may include a substrate. The modulator may include one or more waveguides formed upon or formed in the substrate. A signal electrode may be provided adjacent to at least one of the one or more waveguides and may include a curved outer surface. The modulator may include one or more ground electrodes provided adjacent to the signal electrode. Each ground electrode, of the one or more ground electrodes, may include a respective curved inner surface that is radially spaced from the curved outer surface of the signal electrode. The one or more ground electrodes and the substrate may at least substantially enclose the curved outer surface of the signal electrode. |
---|---|
Bibliography: | Application Number: US201615091224 |