Micro-hoses for integrated circuit and device level cooling

A heat-dissipating device includes at least one heat-dissipating surface and a micro-sized cooling mechanism formed directly on the heat-dissipating surface by an additive manufacturing process. The cooling mechanism includes at least one fluid passage, such as a micro-hose, for carrying a cooling m...

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Bibliographic Details
Main Author Milne, Jason G
Format Patent
LanguageEnglish
Published 01.05.2018
Subjects
BASIC ELECTRIC ELEMENTS
BOARDS, SUBSTATIONS, OR SWITCHING ARRANGEMENTS FOR THE SUPPLYOR DISTRIBUTION OF ELECTRIC POWER
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
GENERATION
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:A heat-dissipating device includes at least one heat-dissipating surface and a micro-sized cooling mechanism formed directly on the heat-dissipating surface by an additive manufacturing process. The cooling mechanism includes at least one fluid passage, such as a micro-hose, for carrying a cooling medium from a coolant source directly to the heat-dissipating surface. The cooling mechanism is fluidly sealed to the heat-dissipating surface such that the cooling medium is in thermal contact directly with the heat-dissipating surface.
Bibliography:Application Number: US201615172690