Semiconductor package structure and method for manufacturing the same

A semiconductor package structure includes a substrate, a semiconductor element, an encapsulant, an adhesion layer and a metal cap. The semiconductor element is disposed on the substrate. The encapsulant covers the semiconductor element. The adhesion layer is disposed on the encapsulant. The metal c...

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Bibliographic Details
Main Authors Lee, Chiu-Wen, Sung, Po-Hsien, Chiu, Ying-Ta, Chen, Dao-Long, Yang, Ping-Feng, Lin, Kwang-Lung
Format Patent
LanguageEnglish
Published 24.04.2018
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A semiconductor package structure includes a substrate, a semiconductor element, an encapsulant, an adhesion layer and a metal cap. The semiconductor element is disposed on the substrate. The encapsulant covers the semiconductor element. The adhesion layer is disposed on the encapsulant. The metal cap is attached to the encapsulant by the adhesion layer, and the metal cap is conformal with the encapsulant.
Bibliography:Application Number: US201615299236