Fluid-filled microchannels

A device comprises a first layer of a die. The first layer comprises a microchannel. The microchannel is partially filled with a liquid and partially filled with air. The die also comprises a second layer. The second layer of the die seals a top of the microchannel of the first layer.

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Bibliographic Details
Main Authors Kumari, Niru, Escobar-Vargas, Sergio
Format Patent
LanguageEnglish
Published 24.04.2018
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A device comprises a first layer of a die. The first layer comprises a microchannel. The microchannel is partially filled with a liquid and partially filled with air. The die also comprises a second layer. The second layer of the die seals a top of the microchannel of the first layer.
Bibliography:Application Number: US201615216969