Method of semiconductor integrated circuit fabrication

• Main Authors: Peng, Chao-Hsien, Yeh, Ching-Fu, Wu, Hsien-Chang, Lee, Hsiang-Huan
• Format: Patent
• Language: English
• Published: 17.04.2018
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A method of fabricating a semiconductor integrated circuit (IC) is disclosed. The method includes providing a substrate and depositing a conductive layer on the substrate. A patterned hard mask and a catalyst layer are formed on the conductive layer. The method further includes growing a plurality o...