Semiconductor chip scale package and manufacturing method thereof

A surface mounting semiconductor component includes a semiconductor device, a circuit board, a number of first solder bumps, and a number of second solder bumps. The semiconductor device included a number of die pads. The circuit board includes a number of contact pads. The first solder bumps are co...

Full description

Saved in:
Bibliographic Details
Main Authors Miao Chia-Chun, Wu Kai-Chiang, Liu Ming-Kai, Lu Chun-Lin, Liang Shih-Wei, Wang Yen-Ping, Yang Ching-Feng
Format Patent
LanguageEnglish
Published 10.04.2018
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:A surface mounting semiconductor component includes a semiconductor device, a circuit board, a number of first solder bumps, and a number of second solder bumps. The semiconductor device included a number of die pads. The circuit board includes a number of contact pads. The first solder bumps are configured to bond the semiconductor device and the circuit board. Each of the first solder bumps connects at least two die pads with a corresponding contact pad. Each of the second solder bumps connects a die pad with a corresponding contact pad. A method of forming a surface mounting component or a chip scale package assembly wherein the component or assembly has at least two different types of solder bumps.
Bibliography:Application Number: US201313934982