High-power laser diode packaging method and laser diode module
In both aspects of the disclosure, a temperature of a p-n junction of the laser diode remains substantially constant within a 0 to 2° C. temperature range through a predetermined amount of several hundred of repeated thermo-cycles which is indicative of uncompromised integrity of the soft solder.
Saved in:
Main Authors | , , , , |
---|---|
Format | Patent |
Language | English |
Published |
03.04.2018
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Summary: | In both aspects of the disclosure, a temperature of a p-n junction of the laser diode remains substantially constant within a 0 to 2° C. temperature range through a predetermined amount of several hundred of repeated thermo-cycles which is indicative of uncompromised integrity of the soft solder. |
---|---|
Bibliography: | Application Number: US201615281443 |