Chip on chip attach (passive IPD and PMIC) flip chip BGA using new cavity BGA substrate

An integrated passive device and power management integrated circuit are directly connected, active surface to active surface, resulting in a pyramid die stack. The die stack is flip-chip attached to a laminate substrate having a cavity drilled therein wherein the smaller die fits into the cavity. T...

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Bibliographic Details
Main Author Kent Ian
Format Patent
LanguageEnglish
Published 27.03.2018
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:An integrated passive device and power management integrated circuit are directly connected, active surface to active surface, resulting in a pyramid die stack. The die stack is flip-chip attached to a laminate substrate having a cavity drilled therein wherein the smaller die fits into the cavity. The die to die attach is not limited to IPD and PMIC and can be used for other die types as required.
Bibliography:Application Number: US201615299910