Aluminum base alloy with high thermal conductivity for die casting

The present invention relates to an aluminum base alloy with high thermal conductivity, and more particularly, to an alloy for die casting that does not become brittle and has high thermal conductivity, so as to be easily used for LED lighting parts, and contains 0.2 to 2.0 wt % of Mg, 0.1 to 0.3 wt...

Full description

Saved in:
Bibliographic Details
Main Authors Seo Ho Sung, Kang Gi Dong
Format Patent
LanguageEnglish
Published 20.03.2018
Subjects
Online AccessGet full text

Cover

Loading…
More Information
Summary:The present invention relates to an aluminum base alloy with high thermal conductivity, and more particularly, to an alloy for die casting that does not become brittle and has high thermal conductivity, so as to be easily used for LED lighting parts, and contains 0.2 to 2.0 wt % of Mg, 0.1 to 0.3 wt % of Fe, 0.1 to 1.0 wt % of Co, with the remainder being Al.
Bibliography:Application Number: US201013391156