Method and apparatus to fold optics in tools for measuring shape and/or thickness of a large and thin substrate

A semiconductor measuring tool has a folding mirror configuration that directs a light beam to pass the same space multiple times to reduce the size and footprint. Furthermore, the folding mirrors may reflect the light beam at less than forty-five degrees; thereby allowing for smaller folding mirror...

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Bibliographic Details
Main Authors An Zeng Andrew, Zhang Yi, Goodman Frederick Arnold, Wang Chunhai, Huang Chunsheng, Tang Shouhong
Format Patent
LanguageEnglish
Published 27.02.2018
Subjects
ELECTRIC COMMUNICATION TECHNIQUE
ELECTRICITY
MEASURING
MEASURING ANGLES
MEASURING AREAS
MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
OPTICS
PHYSICS
PICTORIAL COMMUNICATION, e.g. TELEVISION
TESTING
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Summary:A semiconductor measuring tool has a folding mirror configuration that directs a light beam to pass the same space multiple times to reduce the size and footprint. Furthermore, the folding mirrors may reflect the light beam at less than forty-five degrees; thereby allowing for smaller folding mirrors as compared to the prior art.
Bibliography:Application Number: US201615063057