Metal line layout based on line shifting

A method of Back-End-Of-Line processing of a semiconductor device is provided including providing a layout for metal lines of a metallization layer of the semiconductor device, determining a semi-isolated metal line in the provided layout and shifting at least a portion of the determined semi-isolat...

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Bibliographic Details
Main Authors Lehr Matthias U, Hassmann Jens, Herrmann Thomas, Kuncha Rakesh Kumar, Meyer Moritz Andreas, Melde Thomas
Format Patent
LanguageEnglish
Published 20.02.2018
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Summary:A method of Back-End-Of-Line processing of a semiconductor device is provided including providing a layout for metal lines of a metallization layer of the semiconductor device, determining a semi-isolated metal line in the provided layout and shifting at least a portion of the determined semi-isolated metal line.
Bibliography:Application Number: US201615045466