Molding apparatus

• Main Authors: Koga Shotaro, Masaka Takeshi, Watanabe Shigeru, Kurano Yoshihiro, Urakawa Tetsuya, Shimazoe Toshihiro
• Format: Patent
• Language: English
• Published: 20.02.2018
• Subjects: AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; BASIC ELECTRIC ELEMENTS; ELECTRICITY; INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES; INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS; PERFORMING OPERATIONS; PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSIONOF CHEMICAL INTO ELECTRICAL ENERGY; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

In order to achieve lower costs in a molding apparatus using a mold by reducing mold cleaning steps following releasing of the product from the mold and shortening the molding cycle, the apparatus is equipped with a plurality of fixed molds and movable molds which are heated to the temperature necessary to harden a molding material and come together by means of clamping to form a cavity, and a non-heated cold runner which supplies the molding material from an injection device to the interior of the cavity via a gate opened in the movable mold, the fixed molds and movable molds being movable between an injection stage where the injection device and cold runner (32) are present and an opening stage near the injection stage.