Multilayer electronic component, manufacturing method thereof, and board having the same mounted thereon

A multilayer electronic component, a manufacturing method thereof, and a board having the same. The multilayer electronic component includes a plurality of magnetic metal layers, an internal conductive layer formed on the magnetic metal layer, an upper and lower cover layers formed on and below an a...

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Main Authors Cheon Min Kyoung, Moon Byeong Cheol, Kim Ic Seob, Song So Yeon, Lee Young Il, Choi Yu Jin, Kim Myeong Gi, Kim Ho Yoon, Son Soo Hwan
Format Patent
LanguageEnglish
Published 13.02.2018
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INDUCTANCES
MAGNETS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
TRANSFORMERS
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Summary:A multilayer electronic component, a manufacturing method thereof, and a board having the same. The multilayer electronic component includes a plurality of magnetic metal layers, an internal conductive layer formed on the magnetic metal layer, an upper and lower cover layers formed on and below an active part including the plurality of magnetic metal layers and internal conductive layer. The multilayer electronic component may have excellent DC bias characteristics by using a magnetic metal material, implement low direction resistance (Rdc) by increasing a cross-sectional area of an internal coil, and secure high magnetic permeability while decreasing a core loss of the magnetic metal material to thereby improve efficiency characteristic.
Bibliography:Application Number: US201414289025