Method of forming masks
A method of forming a set of masks for manufacturing an integrated circuit includes determining a presence of a first via layout pattern and a power rail layout pattern in an original layout design. The first via layout pattern and the power rail layout pattern overlap each other. The first via layo...
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Main Authors | , , |
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Format | Patent |
Language | English |
Published |
13.02.2018
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Subjects | |
Online Access | Get full text |
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Summary: | A method of forming a set of masks for manufacturing an integrated circuit includes determining a presence of a first via layout pattern and a power rail layout pattern in an original layout design. The first via layout pattern and the power rail layout pattern overlap each other. The first via layout pattern is part of a first cell layout of the original layout design. The power rail layout pattern is shared by the first cell layout and a second cell layout of the original layout design. The method further includes modifying the original layout design to become a modified layout design and forming the set of masks based on the modified layout design. The modifying the original layout design includes, if the first via layout pattern and the power rail are present in the original layout design, replacing the first via layout pattern with an enlarged via layout pattern. |
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Bibliography: | Application Number: US201614995413 |