Method of forming three-dimensional wire loops and wire loops formed using the method

• Main Authors: Kim Jung Min, Grijaldo Jeffrey, Park Chi Kwan, Lee Joon Ho, Song Keng Yew
• Format: Patent
• Language: English
• Published: 30.01.2018
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention provides a method of bonding wire between first and second bonding points with a bonding tool. It comprises the steps of forming a first bond at the first bonding point with the bonding tool, forming a first kink located over the first bond, and moving the bonding tool to a first position spaced from the first kink by a predetermined distance to release a length of wire from the bonding tool. It further comprises the step of moving the bonding tool in a direction away from the second bonding point to a second position which is outside a plane comprising the first bonding point, the second bonding point, and the first kink. It also comprises the steps of forming a second kink which lies outside the plane, and moving the bonding tool to the second bonding point to form a second bond.