Chip package with thermal dissipation structure and method for forming the same

• Main Authors: Jeng Shin-Puu, Lee Kuang-Chun, Leu Shyue-Ter, Yu Hsiu-Mei, Wang Chin-Hua, Yeh Shu-Shen, Huang Cheng-Lin, Lin Po-Yao
• Format: Patent
• Language: English
• Published: 16.01.2018
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

Structures and formation methods of a chip package are provided. The chip package includes a first package structure including a first semiconductor die that has a first side and a second side opposite thereto. The chip package also includes a package layer partially or completely encapsulating the...