Chip package with thermal dissipation structure and method for forming the same

Structures and formation methods of a chip package are provided. The chip package includes a first package structure including a first semiconductor die that has a first side and a second side opposite thereto. The chip package also includes a package layer partially or completely encapsulating the...

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Bibliographic Details
Main Authors Jeng Shin-Puu, Lee Kuang-Chun, Leu Shyue-Ter, Yu Hsiu-Mei, Wang Chin-Hua, Yeh Shu-Shen, Huang Cheng-Lin, Lin Po-Yao
Format Patent
LanguageEnglish
Published 16.01.2018
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:Structures and formation methods of a chip package are provided. The chip package includes a first package structure including a first semiconductor die that has a first side and a second side opposite thereto. The chip package also includes a package layer partially or completely encapsulating the first semiconductor die, and a conductive feature in the package layer. The chip package further includes a first heat-spreading layer over the first side of the first semiconductor die and a first cap layer on the first heat-spreading layer.
Bibliography:Application Number: US201615210343