Chip package with thermal dissipation structure and method for forming the same
Structures and formation methods of a chip package are provided. The chip package includes a first package structure including a first semiconductor die that has a first side and a second side opposite thereto. The chip package also includes a package layer partially or completely encapsulating the...
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| Main Authors | , , , , , , , |
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| Format | Patent |
| Language | English |
| Published |
16.01.2018
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| Subjects | |
| Online Access | Get full text |
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| Abstract | Structures and formation methods of a chip package are provided. The chip package includes a first package structure including a first semiconductor die that has a first side and a second side opposite thereto. The chip package also includes a package layer partially or completely encapsulating the first semiconductor die, and a conductive feature in the package layer. The chip package further includes a first heat-spreading layer over the first side of the first semiconductor die and a first cap layer on the first heat-spreading layer. |
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| AbstractList | Structures and formation methods of a chip package are provided. The chip package includes a first package structure including a first semiconductor die that has a first side and a second side opposite thereto. The chip package also includes a package layer partially or completely encapsulating the first semiconductor die, and a conductive feature in the package layer. The chip package further includes a first heat-spreading layer over the first side of the first semiconductor die and a first cap layer on the first heat-spreading layer. |
| Author | Lee Kuang-Chun Wang Chin-Hua Huang Cheng-Lin Lin Po-Yao Jeng Shin-Puu Yu Hsiu-Mei Leu Shyue-Ter Yeh Shu-Shen |
| Author_xml | – fullname: Jeng Shin-Puu – fullname: Lee Kuang-Chun – fullname: Leu Shyue-Ter – fullname: Yu Hsiu-Mei – fullname: Wang Chin-Hua – fullname: Yeh Shu-Shen – fullname: Huang Cheng-Lin – fullname: Lin Po-Yao |
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| Notes | Application Number: US201615210343 |
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| RelatedCompanies | Taiwan Semiconductor Manufacturing Co., Ltd |
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| Snippet | Structures and formation methods of a chip package are provided. The chip package includes a first package structure including a first semiconductor die that... |
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| SubjectTerms | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| Title | Chip package with thermal dissipation structure and method for forming the same |
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