Embedding additive particles in encapsulant of electronic device

An electronic device comprising a carrier having a mounting surface, at least one electronic chip mounted on the mounting surface, an encapsulant at least partially encapsulating the carrier and the at least one electronic chip, and a plurality of capsules in the encapsulant, wherein the capsules co...

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Bibliographic Details
Main Authors Tan Yik Yee, Mahler Joachim, Teh Peh Hean, Krishnan Jagen, Tai Chew Theng, Lee Swee Kah, Goh Soon Lock, Lim Poh Cheng
Format Patent
LanguageEnglish
Published 26.12.2017
Subjects
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
BASIC ELECTRIC ELEMENTS
CHEMISTRY
DYES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
POLISHES
SEMICONDUCTOR DEVICES
USE OF MATERIALS AS ADHESIVES
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Summary:An electronic device comprising a carrier having a mounting surface, at least one electronic chip mounted on the mounting surface, an encapsulant at least partially encapsulating the carrier and the at least one electronic chip, and a plurality of capsules in the encapsulant, wherein the capsules comprise a core comprising an additive and comprise a shell, in particular a crackable shell, enclosing the core.
Bibliography:Application Number: US201514835750