Automatic bonding system for liquid crystal display device and automatic bonding method using the same

Disclosed is an automatic bonding system for an LCD device. The automatic bonding system includes a bonding unit configured to perform a process of bonding a first substrate to a second substrate, a first substrate supply unit configured to include an inverting arm and supply the first substrate to...

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Bibliographic Details
Main Authors Jung Wan Woo, Kim Chun Il, Lee Seung Lyul, Lee Seung kil, Park Chang Yeol
Format Patent
LanguageEnglish
Published 05.12.2017
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Summary:Disclosed is an automatic bonding system for an LCD device. The automatic bonding system includes a bonding unit configured to perform a process of bonding a first substrate to a second substrate, a first substrate supply unit configured to include an inverting arm and supply the first substrate to the bonding unit, a second substrate supply unit configured to include an adhesive resin coating unit and supply the second substrate to the bonding unit, a pre-hardening unit configured to perform a process of pre-hardening an adhesive resin that adheres the first and second substrates, and a hardening unit configured to perform a process of hardening the adhesive resin that adheres the first and second substrates. A gap between the first and second substrates bonded to each other by the bonding unit is a bonding gap controlled by a gap variable control stage.
Bibliography:Application Number: US201314135101