Semiconductor packages having an electric device with a recess
Embodiments are directed to a package that includes an electric device having a recess. In one embodiment, the electric device is a sensor and the recess reduces signal drift of the sensor caused by thermal expansion of the package. In another embodiment, the recess is substantially filled with adhe...
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Main Authors | , , |
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Format | Patent |
Language | English |
Published |
21.11.2017
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Subjects | |
Online Access | Get full text |
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Summary: | Embodiments are directed to a package that includes an electric device having a recess. In one embodiment, the electric device is a sensor and the recess reduces signal drift of the sensor caused by thermal expansion of the package. In another embodiment, the recess is substantially filled with adhesive material, thus increasing adhesion between the electric device and a substrate of the package while at the same time allowing for lower adhesive fillets. |
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Bibliography: | Application Number: US201313853856 |