Semiconductor package interconnect

A semiconductor package interconnect system may include a conductive pillar having a core, a first layer surrounding the core, and a second layer surrounding the first layer. The core may be composed of a drawn copper wire, the first layer may be composed of nickel, and the second layer may be compo...

Full description

Saved in:
Bibliographic Details
Main Authors Keser Lizabeth Ann, Alvarado Reynante Tamunan
Format Patent
LanguageEnglish
Published 31.10.2017
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:A semiconductor package interconnect system may include a conductive pillar having a core, a first layer surrounding the core, and a second layer surrounding the first layer. The core may be composed of a drawn copper wire, the first layer may be composed of nickel, and the second layer may be composed of a solder. A method for manufacturing a semiconductor package with such a conductive pillar may include placing a plurality of conductive pillars on a substrate using a stencil process.
Bibliography:Application Number: US201514854039