Electronic device having a redistribution area

An electronic device includes an upper insulating layer on a substrate. An upper redistribution structure is embedded in the upper insulating layer. The upper redistribution structure includes an upper contact portion, an upper pad portion, and an upper line portion between the upper contact portion...

Full description

Saved in:
Bibliographic Details
Main Authors Lee Kyu-Ha, Chun Jinho, Park Byunglyul, Jin Jeonggi, An Jinho
Format Patent
LanguageEnglish
Published 24.10.2017
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:An electronic device includes an upper insulating layer on a substrate. An upper redistribution structure is embedded in the upper insulating layer. The upper redistribution structure includes an upper contact portion, an upper pad portion, and an upper line portion between the upper contact portion and the upper pad portion. A passivation layer is on the upper insulating layer and the upper redistribution structure. An upper opening is configured to pass through the passivation layer and expose the upper pad portion. Vertical thicknesses of the upper pad portion and the upper contact portion are greater than a vertical thickness of the upper line portion.
Bibliography:Application Number: US201615209298