Adhesive having structural integrity and insulative properties

• Main Authors: Waski Daniel, Sandilla Robert, Thompson Kristina, Meccia John, Huang Tianjian
• Format: Patent
• Language: English
• Published: 26.09.2017
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; DYES; IMPREGNATING OR COATING OF PAPER; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; PAPER NOT OTHERWISE PROVIDED FOR; PAPER-MAKING; PERFORMING OPERATIONS; POLISHES; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; PRODUCTION OF CELLULOSE; PULP COMPOSITIONS; TEXTILES; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; USE OF MATERIALS AS ADHESIVES

An adhesive composition that provides improved structural integrity and insulative properties when applied to a substrate is provided. The adhesive composition includes an emulsion-based polymer, a plurality of microspheres; and optionally, water and plasticizer.