Electrodes for etch
An electrode having a first portion and a second portion is formed over a substrate to couple to a bias RF power. The first portion is configured to compensate for an electric field at the second portion to even out a distribution of an etching strength over a workpiece placed over the electrode.
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Main Authors | , , , |
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Format | Patent |
Language | English |
Published |
05.09.2017
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Subjects | |
Online Access | Get full text |
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Summary: | An electrode having a first portion and a second portion is formed over a substrate to couple to a bias RF power. The first portion is configured to compensate for an electric field at the second portion to even out a distribution of an etching strength over a workpiece placed over the electrode. |
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Bibliography: | Application Number: US201314042490 |