Plasma dry strip pretreatment to enhance ion implanted resist removal
Systems and methods for processing a substrate include exposing a substrate to UV light from a UV light source having a predetermined wavelength range. The substrate includes a photoresist layer that has been bombarded with ions. The method includes controlling a temperature of the substrate, while...
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Main Authors | , |
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Format | Patent |
Language | English |
Published |
22.08.2017
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Subjects | |
Online Access | Get full text |
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Summary: | Systems and methods for processing a substrate include exposing a substrate to UV light from a UV light source having a predetermined wavelength range. The substrate includes a photoresist layer that has been bombarded with ions. The method includes controlling a temperature of the substrate, while exposing the substrate to the UV light, to a temperature less than or equal to a first temperature. The method includes removing the photoresist layer using plasma while maintaining a temperature of the substrate to less than or equal to a strip process temperature after exposing the substrate to the UV light. |
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Bibliography: | Application Number: US201414268455 |