Method, apparatus and system for configuring a protocol stack of an integrated circuit chip
Techniques and mechanisms for configuring an integrated circuit (IC) chip to implement a protocol stack. In an embodiment, a transaction layer of the IC chip is operable to exchange with a link layer of the IC chip transaction layer packets (TLPs) having a format compatible with one defined in a Per...
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Main Authors | , , , , , , , |
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Format | Patent |
Language | English |
Published |
15.08.2017
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Abstract | Techniques and mechanisms for configuring an integrated circuit (IC) chip to implement a protocol stack. In an embodiment, a transaction layer of the IC chip is operable to exchange with a link layer of the IC chip transaction layer packets (TLPs) having a format compatible with one defined in a Peripheral Component Interconnect Express™ (PCIe™) specification. Configuration circuitry of the IC chip provides for configuration of a first protocol stack including the transaction layer, circuitry of the link layer and a first physical layer of the IC chip. The configuration circuitry further provides for an alternative configuration of a second protocol stack including the transaction layer, circuitry of the link layer and a second physical layer of the IC chip. In another embodiment, the first protocol stack supports single-ended signaling to communicate TLP information, whereas the second protocol stack supports differential signaling to communicate TLP information. |
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AbstractList | Techniques and mechanisms for configuring an integrated circuit (IC) chip to implement a protocol stack. In an embodiment, a transaction layer of the IC chip is operable to exchange with a link layer of the IC chip transaction layer packets (TLPs) having a format compatible with one defined in a Peripheral Component Interconnect Express™ (PCIe™) specification. Configuration circuitry of the IC chip provides for configuration of a first protocol stack including the transaction layer, circuitry of the link layer and a first physical layer of the IC chip. The configuration circuitry further provides for an alternative configuration of a second protocol stack including the transaction layer, circuitry of the link layer and a second physical layer of the IC chip. In another embodiment, the first protocol stack supports single-ended signaling to communicate TLP information, whereas the second protocol stack supports differential signaling to communicate TLP information. |
Author | Spry Bryan L Ananthakrishnan Avinash N Wood Aimee D Rangaraj Deepak M Hayes Robert J Boswell Brent R Letendre Adam E Song Marcus W |
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RelatedCompanies | Intel Corporation Spry Bryan L Ananthakrishnan Avinash N Wood Aimee D Rangaraj Deepak M Hayes Robert J Boswell Brent R Letendre Adam E Song Marcus W |
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Snippet | Techniques and mechanisms for configuring an integrated circuit (IC) chip to implement a protocol stack. In an embodiment, a transaction layer of the IC chip... |
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Title | Method, apparatus and system for configuring a protocol stack of an integrated circuit chip |
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