Electronic device and method of bonding the same

An electronic device including a first electronic component including a first pad unit, a second electronic component electrically connected to the first electronic component, the second electronic component including a second pad unit connected to the first pad unit, and a conductive adhesion film...

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Bibliographic Details
Main Authors Hwang Hyeondeuk, Kim Taesik
Format Patent
LanguageEnglish
Published 08.08.2017
Subjects
ELECTRIC HEATING
ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
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Summary:An electronic device including a first electronic component including a first pad unit, a second electronic component electrically connected to the first electronic component, the second electronic component including a second pad unit connected to the first pad unit, and a conductive adhesion film that couples the first pad unit to the second pad unit. The conductive adhesion film includes an adhesion resin layer, a conductive ball dispersed in the adhesion resin layer, and a curing agent capsule dispersed in the adhesion resin layer, the curing agent capsule including a curing initiator and a tube that seals the curing initiator.
Bibliography:Application Number: US201514944765