Integrated circuit package having two substrates

A packaged IC device in which a die is sandwiched between first and second substrates such that (i) peripheral electrical contact pads of the die are wire bonded to the first substrate, e.g., for routing functional input/output signals, and (ii) core-area electrical contact pads of the die are conne...

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Bibliographic Details
Main Authors Kalandar Navas Khan Oratti, Tan Lan Chu, Verma Chetan
Format Patent
LanguageEnglish
Published 01.08.2017
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A packaged IC device in which a die is sandwiched between first and second substrates such that (i) peripheral electrical contact pads of the die are wire bonded to the first substrate, e.g., for routing functional input/output signals, and (ii) core-area electrical contact pads of the die are connected to the second substrate in a flip-chip arrangement, e.g., for routing one or more power supply voltages to the core area of the die. The second substrate has a shape and position that (i) expose the peripheral electrical contact pads of the die for unencumbered machine-implemented wire bonding during the assembly process, and (ii) enable direct electrical connections between the first and second substrates outside the footprint of the die, e.g., by way of the corresponding solder bumps attached between the two substrates.
Bibliography:Application Number: US201615141628