Methods of fabricating semiconductor die assemblies
Methods of fabricating multi-die assemblies including a base semiconductor die bearing a peripherally encapsulated stack of semiconductor dice of lesser lateral dimensions, the dice vertically connected by conductive elements between the dice, resulting assemblies, and semiconductor devices comprisi...
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Main Authors | , , |
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Format | Patent |
Language | English |
Published |
18.07.2017
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Subjects | |
Online Access | Get full text |
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Summary: | Methods of fabricating multi-die assemblies including a base semiconductor die bearing a peripherally encapsulated stack of semiconductor dice of lesser lateral dimensions, the dice vertically connected by conductive elements between the dice, resulting assemblies, and semiconductor devices comprising such assemblies. |
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Bibliography: | Application Number: US201514600976 |