Use of a full width array imaging sensor to measure real time film thicknesses on film manufacturing equipment

A method for providing film-thickness analysis with a spectrophotometer includes configuring an illuminator to emit a light beam at a film deposited on a substrate surface, configuring a linear sensor to receive light reflecting off the deposited film on the substrate surface via a gradient index le...

Full description

Saved in:
Bibliographic Details
Main Authors Bonino Paul S, LeFevre Jason M, Herloski Robert P
Format Patent
LanguageEnglish
Published 11.07.2017
Subjects
MEASURING
MEASURING ANGLES
MEASURING AREAS
MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS
PHYSICS
TESTING
Online AccessGet full text

Cover

More Information
Summary:A method for providing film-thickness analysis with a spectrophotometer includes configuring an illuminator to emit a light beam at a film deposited on a substrate surface, configuring a linear sensor to receive light reflecting off the deposited film on the substrate surface via a gradient index lens and a linear variable filter, and configuring a processor to determine thickness of the film based on spectral reflectivity of the film received from the linear sensor.
Bibliography:Application Number: US201514743491