Copolymer and resin composition, packaging film and package structure including the same

A copolymer and a resin composition, packaging film and package structure including the same are disclosed. The copolymer includes 40-80% by mol of a repeating unit shown as a formula (I), 5-25% by mol of a repeating unit shown as a formula (II) and 5-30% by mol of a repeating unit shown as a formul...

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Bibliographic Details
Main Authors Huang Yao-Jheng, Lai Yun-Yu, Wu Ming-Tzung, Chang Te-Yi
Format Patent
LanguageEnglish
Published 04.07.2017
Subjects
BASIC ELECTRIC ELEMENTS
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
SEMICONDUCTOR DEVICES
THEIR PREPARATION OR CHEMICAL WORKING-UP
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Summary:A copolymer and a resin composition, packaging film and package structure including the same are disclosed. The copolymer includes 40-80% by mol of a repeating unit shown as a formula (I), 5-25% by mol of a repeating unit shown as a formula (II) and 5-30% by mol of a repeating unit shown as a formula (III), wherein R1 is C6-C13 aryl, C7-C13 aralkyl, C6-C8 halogenated aryl or C7-C8 aromatic oxyalkyl, R3 is C3-C16 alkyl or alkyl substituted by C3-C6 alkoxy aryl, R5 is a single bond or C1-C3 alkylene, R6 and R7 are independently C1-C3 alkoxy, R8 is polysiloxane having methyl and phenyl, and R2, R4 and R9 are independently hydrogen or methyl separately.
Bibliography:Application Number: US201615386400