Wireless module with active devices

In a general aspect, a wireless multichip module can include a leadframe structure with portions configured to receive at least one flip-chip mounted semiconductor die, including one or more of an integrated circuit, a high side MOSFET and/or a low side MOSFET, which can form a half-bridge circuit t...

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Bibliographic Details
Main Authors Manatad Romel N, Flores Allan Tungul
Format Patent
LanguageEnglish
Published 04.07.2017
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:In a general aspect, a wireless multichip module can include a leadframe structure with portions configured to receive at least one flip-chip mounted semiconductor die, including one or more of an integrated circuit, a high side MOSFET and/or a low side MOSFET, which can form a half-bridge circuit that is encapsulated in a molding compound. The module can be assembled without any bond wires (e.g., be wireless). The module may include carry passive components including an external input capacitor and/or an internal input capacitor.
Bibliography:Application Number: US201314020775