Wireless module with active devices
In a general aspect, a wireless multichip module can include a leadframe structure with portions configured to receive at least one flip-chip mounted semiconductor die, including one or more of an integrated circuit, a high side MOSFET and/or a low side MOSFET, which can form a half-bridge circuit t...
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Main Authors | , |
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Format | Patent |
Language | English |
Published |
04.07.2017
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Subjects | |
Online Access | Get full text |
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Summary: | In a general aspect, a wireless multichip module can include a leadframe structure with portions configured to receive at least one flip-chip mounted semiconductor die, including one or more of an integrated circuit, a high side MOSFET and/or a low side MOSFET, which can form a half-bridge circuit that is encapsulated in a molding compound. The module can be assembled without any bond wires (e.g., be wireless). The module may include carry passive components including an external input capacitor and/or an internal input capacitor. |
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Bibliography: | Application Number: US201314020775 |