Method, apparatus, and system for MOL interconnects without titanium liner

• Main Authors: Kamineni Vimal, Raymond Mark V, Adusumilli Praneet, Niu Chengyu
• Format: Patent
• Language: English
• Published: 13.06.2017
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

Methods, apparatus, and systems for fabricating a semiconductor device comprising a semiconductor substrate; an oxide layer above the semiconductor substrate; a first metal component comprising tungsten disposed within the oxide layer; an interlayer dielectric (ILD) above the oxide layer, wherein th...