Power semiconductor module

• Main Authors: Kokubun Shuichi, Harada Tsuyoshi, Yamada Takeshi, Watari Shinjiro
• Format: Patent
• Language: English
• Published: 30.05.2017
• Subjects: BASIC ELECTRIC ELEMENTS; BLASTING; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; COMBUSTION ENGINES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC SWITCHES; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; EMERGENCY PROTECTIVE DEVICES; HEATING; HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS; LIGHTING; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; MECHANICAL ENGINEERING; PRINTED CIRCUITS; RELAYS; SELECTORS; SEMICONDUCTOR DEVICES; STARTING AIDS FOR SUCH ENGINES, NOT OTHERWISE PROVIDEDFOR; STARTING OF COMBUSTION ENGINES; WEAPONS

Provided is a power semiconductor module wherein stress generated at a soldering section of a relay terminal is relaxed. A power semiconductor module (1) is provided with a substrate (2), relay terminals (9, 10), external connecting terminals (13, 14) and a relay terminal holding member (6). The relay terminals (9, 10) are connected to the substrate (2) with a solder (4) therebetween. The external connecting terminals (13, 14) are bonded to the relay terminals (9, 10), respectively. The non-conductive relay terminal holding member (6) holds end portions of the relay terminals (9, 10) said end portions being on the side bonded to the solder (4).