Power semiconductor module

Provided is a power semiconductor module wherein stress generated at a soldering section of a relay terminal is relaxed. A power semiconductor module (1) is provided with a substrate (2), relay terminals (9, 10), external connecting terminals (13, 14) and a relay terminal holding member (6). The rel...

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Bibliographic Details
Main Authors Kokubun Shuichi, Harada Tsuyoshi, Yamada Takeshi, Watari Shinjiro
Format Patent
LanguageEnglish
Published 30.05.2017
Subjects
BASIC ELECTRIC ELEMENTS
BLASTING
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
COMBUSTION ENGINES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC SWITCHES
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
EMERGENCY PROTECTIVE DEVICES
HEATING
HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
LIGHTING
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
MECHANICAL ENGINEERING
PRINTED CIRCUITS
RELAYS
SELECTORS
SEMICONDUCTOR DEVICES
STARTING AIDS FOR SUCH ENGINES, NOT OTHERWISE PROVIDEDFOR
STARTING OF COMBUSTION ENGINES
WEAPONS
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Summary:Provided is a power semiconductor module wherein stress generated at a soldering section of a relay terminal is relaxed. A power semiconductor module (1) is provided with a substrate (2), relay terminals (9, 10), external connecting terminals (13, 14) and a relay terminal holding member (6). The relay terminals (9, 10) are connected to the substrate (2) with a solder (4) therebetween. The external connecting terminals (13, 14) are bonded to the relay terminals (9, 10), respectively. The non-conductive relay terminal holding member (6) holds end portions of the relay terminals (9, 10) said end portions being on the side bonded to the solder (4).
Bibliography:Application Number: US201414903713