Microelectromechanical systems (MEMS) devices at different pressures

• Main Authors: Hung Chia-Ming, Chen Hsiang-Fu, Tai Wen-Chuan, Chang Allen Timothy, Chou Bruce C. S, Huang Hsin-Ting, Lin Chin-Min, Yu Shao-Chi
• Format: Patent
• Language: English
• Published: 23.05.2017
• Subjects: MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES; MICROSTRUCTURAL TECHNOLOGY; PERFORMING OPERATIONS; TRANSPORTING

Some embodiments relate to multiple MEMS devices that are integrated together on a single substrate. A device substrate comprising first and second micro-electro mechanical system (MEMS) devices is bonded to a capping structure. The capping structure comprises a first cavity arranged over the first MEMS device and a second cavity arranged over the second MEMS device. The first cavity is filled with a first gas at a first gas pressure. The second cavity is filled with a second gas at a second gas pressure, which is different from the first gas pressure. A recess is arranged within a lower surface of the capping structure. The recess abuts the second cavity. A vent is arranged within the capping structure. The vent extends from a top of the recess to the upper surface of the capping structure. A lid is arranged within the vent and configured to seal the second cavity.