Method for manufacturing a non-planar printed circuit board assembly

A method for manufacturing a non-planar printed circuit board assembly (1) is disclosed. The method comprises providing a planar formable substrate (2) for supporting a conductive material (3) and at least one electronic component (4), printing a circuit pattern of an uncured conductive material (3)...

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Bibliographic Details
Main Authors Peels Wilhelmus Gerardus Maria, Deeben Josephus Paulus Augustinus, De Vaan Adrianus Johannes Stephanus Maria
Format Patent
LanguageEnglish
Published 09.05.2017
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:A method for manufacturing a non-planar printed circuit board assembly (1) is disclosed. The method comprises providing a planar formable substrate (2) for supporting a conductive material (3) and at least one electronic component (4), printing a circuit pattern of an uncured conductive material (3) on the planar substrate (2), forming the substrate (2) and the uncured conductive material (3) into a non-planar shape, and curing the conductive material (3), wherein the substrate (2) comprises a metal sheet and an electrically insulating coating (2b) arranged between the metal sheet and the conductive material (3).
Bibliography:Application Number: US201414772888