Packaged semiconductor device with a lead frame and method for forming

A method of manufacturing a packaged semiconductor device includes patterning and plating silver nanoparticles in bonding areas of a lead frame, forming a hydrophilic group while oxidizing the silver nanoparticles, forming wire bonds on the silver nanoparticles, and encapsulating the wire bonds and...

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Bibliographic Details
Main Authors Chopin Sheila, Mathew Varughese
Format Patent
LanguageEnglish
Published 02.05.2017
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A method of manufacturing a packaged semiconductor device includes patterning and plating silver nanoparticles in bonding areas of a lead frame, forming a hydrophilic group while oxidizing the silver nanoparticles, forming wire bonds on the silver nanoparticles, and encapsulating the wire bonds and the silver nanoparticles.
Bibliography:Application Number: US201615051917