Sub-micron laser patterning of graphene and 2D materials

An appropriately configured pulsed laser is focused onto a graphene sheet and is used to form a desired pattern in the graphene. When the laser pulse strikes the graphene, it modifies the bonding state of the carbon atoms in the graphene lattice, acting as a "blade" and causing a separatio...

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Bibliographic Details
Main Authors Nath Anindya, Currie Marc, Gaskill David Kurt
Format Patent
LanguageEnglish
Published 18.04.2017
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Summary:An appropriately configured pulsed laser is focused onto a graphene sheet and is used to form a desired pattern in the graphene. When the laser pulse strikes the graphene, it modifies the bonding state of the carbon atoms in the graphene lattice, acting as a "blade" and causing a separation in the graphene sheet at the site of the laser pulse without causing damage to the surrounding graphene. The width of the separation, or "cut" in the graphene sheet can be controlled by controlling characteristics of the laser pulse such as beam shape, beam intensity, pulse width, repetition rate, and wavelength to produce a graphene material having desired electrical, optical, thermal, and/or mechanical properties.
Bibliography:Application Number: US201414565734