RFID tag assemblies and process

A process is disclosed for attaching an RFID tag such as an AK module or QFP package to a flexible surface such as textile or fabric. The process comprises providing a heat fusible label including at least a first layer having a first adhesive layer, a substrate layer including a secondary antenna s...

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Bibliographic Details
Main Authors Elbaz Didier, Combes Francois, Martin Philippe
Format Patent
LanguageEnglish
Published 18.04.2017
Subjects
CALCULATING
COMPUTING
COUNTING
HANDLING RECORD CARRIERS
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
PERFORMING OPERATIONS
PHYSICS
PRESENTATION OF DATA
RECOGNITION OF DATA
RECORD CARRIERS
TRANSPORTING
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Summary:A process is disclosed for attaching an RFID tag such as an AK module or QFP package to a flexible surface such as textile or fabric. The process comprises providing a heat fusible label including at least a first layer having a first adhesive layer, a substrate layer including a secondary antenna structure, a heat activated second adhesive layer and a pressure sensitive adhesive (PSA) layer for holding the RFID tag. The process further includes positioning the RFID tag on the PSA layer, pressing the tag against the PSA layer such that the PSA layer holds the tag against the heat fusible label at least temporarily, positioning the heat fusible label with the RFID tag on the flexible surface and applying heat and pressure to the heat fusible label to melt the heat activated layer and to fuse the label to the flexible surface.
Bibliography:Application Number: US201314432821