Semiconductor package with an enhanced thermal pad

A semiconductor package having a substrate, a thermal pad, and a semiconductor die is disclosed. The thermal pad may have a heat conductive body extending through the substrate. The semiconductor die may be disposed on the thermal pad and in thermal communication with the thermal pad. The thermal pa...

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Bibliographic Details
Main Authors Khaw Chee Wei Ong, Lim Ewe Lee, Lee Liu Mei, Thong Wing Hung
Format Patent
LanguageEnglish
Published 21.03.2017
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A semiconductor package having a substrate, a thermal pad, and a semiconductor die is disclosed. The thermal pad may have a heat conductive body extending through the substrate. The semiconductor die may be disposed on the thermal pad and in thermal communication with the thermal pad. The thermal pad of the semiconductor package may also have an interlock structure. The interlock structure may provide a mechanical interlock between the thermal pad and the substrate. In addition, a wireless communication device is also disclosed.
Bibliography:Application Number: US201514806428