Stacked microelectronic package assemblies and methods for the fabrication thereof

• Main Author: Yap Weng F
• Format: Patent
• Language: English
• Published: 14.03.2017
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

Stacked microelectronic package assemblies are provided, as are methods for producing stacked microelectronic package assemblies. In one embodiment, the stacked microelectronic package assembly includes a base package layer onto which a stacked bridge device is stacked. The base package layer includes, in turn, a first microelectronic package and a second microelectronic package positioned laterally adjacent the first microelectronic package. The stacked bridge device extends over the first and second microelectronic packages. A first terminal of the stacked bridge device is soldered to or otherwise electrically joined to a first backside contact of the first microelectronic package, and a second terminal of the stacked bridge device is soldered to or otherwise electrically joined to a second backside contact of the second microelectronic package.