Multilevel via placement with improved yield in dual damascene interconnection

A method of operating a computer system to improve via electromigration in an integrated circuit with multilevel interconnect. A method of operating a computer system to improve via electromigration in an integrated circuit with multilevel interconnect using via priority groups.

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Bibliographic Details
Main Author Hong Qi-Zhong
Format Patent
LanguageEnglish
Published 07.03.2017
Subjects
BASIC ELECTRIC ELEMENTS
CALCULATING
COMPUTING
COUNTING
ELECTRIC DIGITAL DATA PROCESSING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
PHYSICS
SEMICONDUCTOR DEVICES
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Abstract A method of operating a computer system to improve via electromigration in an integrated circuit with multilevel interconnect. A method of operating a computer system to improve via electromigration in an integrated circuit with multilevel interconnect using via priority groups.
AbstractList A method of operating a computer system to improve via electromigration in an integrated circuit with multilevel interconnect. A method of operating a computer system to improve via electromigration in an integrated circuit with multilevel interconnect using via priority groups.
Author Hong Qi-Zhong
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Snippet A method of operating a computer system to improve via electromigration in an integrated circuit with multilevel interconnect. A method of operating a computer...
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SubjectTerms BASIC ELECTRIC ELEMENTS
CALCULATING
COMPUTING
COUNTING
ELECTRIC DIGITAL DATA PROCESSING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
PHYSICS
SEMICONDUCTOR DEVICES
Title Multilevel via placement with improved yield in dual damascene interconnection
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