Multilevel via placement with improved yield in dual damascene interconnection
A method of operating a computer system to improve via electromigration in an integrated circuit with multilevel interconnect. A method of operating a computer system to improve via electromigration in an integrated circuit with multilevel interconnect using via priority groups.
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Main Author | |
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Format | Patent |
Language | English |
Published |
07.03.2017
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Subjects | |
Online Access | Get full text |
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Summary: | A method of operating a computer system to improve via electromigration in an integrated circuit with multilevel interconnect. A method of operating a computer system to improve via electromigration in an integrated circuit with multilevel interconnect using via priority groups. |
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Bibliography: | Application Number: US201414577195 |