Package-on-package device

The inventive concepts provide package-on-package (PoP) devices. In the PoP devices, an interposer substrate and a thermal boundary material layer may be disposed between a lower semiconductor package and an upper semiconductor package to rapidly exhaust heat generated from a lower semiconductor chi...

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Bibliographic Details
Main Authors Im Yunhyeok, Jang Eon Soo, Park Kyol, Kim Jichul
Format Patent
LanguageEnglish
Published 28.02.2017
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:The inventive concepts provide package-on-package (PoP) devices. In the PoP devices, an interposer substrate and a thermal boundary material layer may be disposed between a lower semiconductor package and an upper semiconductor package to rapidly exhaust heat generated from a lower semiconductor chip included in the lower semiconductor package. The interposer substrate may be formed of one or more insulating layers, conductive vias, heat dissipating members, protection layers, and various conductive patterns.
Bibliography:Application Number: US201414457094