Thermal enhanced package using embedded substrate
An integrated circuit (IC) device is provided. The IC device includes an IC die having opposing first and second surfaces, a carrier coupled to the first surface of the IC die, a laminate coupled to the carrier and the second surface of the IC die, and a trace located on a surface of the laminate an...
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Main Authors | , |
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Format | Patent |
Language | English |
Published |
07.02.2017
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Subjects | |
Online Access | Get full text |
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Summary: | An integrated circuit (IC) device is provided. The IC device includes an IC die having opposing first and second surfaces, a carrier coupled to the first surface of the IC die, a laminate coupled to the carrier and the second surface of the IC die, and a trace located on a surface of the laminate and electrically coupled to a bond pad located on the second surface of the IC die. The trace is configured to couple the bond pad to a circuit board. |
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Bibliography: | Application Number: US201113030470 |