Semiconductor device and method of fabricating the same

A semiconductor device includes a via structure having a top surface with a planar portion and a protrusion portion that is surrounded by the planar portion, and includes a conductive structure including a plurality of conductive lines contacting at least a part of the top surface of the via structu...

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Bibliographic Details
Main Authors Choi Gil-heyun, Lim Dong-chan, Moon Kwang-jin, Bae Dae-lok, Park Byung-Iyul, Jung Deok-young, Kang Pil-kyu
Format Patent
LanguageEnglish
Published 27.12.2016
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A semiconductor device includes a via structure having a top surface with a planar portion and a protrusion portion that is surrounded by the planar portion, and includes a conductive structure including a plurality of conductive lines contacting at least a part of the top surface of the via structure.
Bibliography:Application Number: US201314052691