Internal chamfering device and method
A method of forming an opening in a layered structure includes providing a layered structure including a first layer and a second layer and a near-zero gap interface defined between the first layer and the second layer; providing an opening through the layered structure such that the opening extends...
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Main Authors | , , |
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Format | Patent |
Language | English |
Published |
13.12.2016
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Subjects | |
Online Access | Get full text |
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Summary: | A method of forming an opening in a layered structure includes providing a layered structure including a first layer and a second layer and a near-zero gap interface defined between the first layer and the second layer; providing an opening through the layered structure such that the opening extends through the first layer and the second layer; and working simultaneously the opening in the fay surface of the first layer and the opening in the fay surface of the second layer without separating the first layer and the second layer. An internal chamfering device is also disclosed. |
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Bibliography: | Application Number: US201313784442 |